Cooling efficiency plays a critical role in both future-proofing the data center and enabling its transition from being a burden on society to a benefit. With the next generation of chips already promising to challenge the world of cooling, we ask the experts their views on the current state of play.

Which areas of cooling are most misunderstood by the industry? Is liquid cooling the silver bullet the industry is looking for? If so, how will we overcome the issues around compatibility and standardization, and the worlds of IT and mechanical electrical systems meeting? Is evolution to a hybrid scenario the most likely outcome? And if significant change is required who will be driving that change - the industry or the customer? This panel will examine where we currently are in the cooling landscape and what direction we need to be heading in to meet the demands of new chip densities and the increasing need for more sustainable solutions.