Huawei has launched its latest liquid-cooled High Performance Computing platform at the Supercomputing Conference 2016 (SC16) in Salt Lake City.

The FusionServer X6000 promises higher efficiency than its predecessors thanks to the adoption of the latest Xeon CPUs and improved flash storage performance.

“The FusionServer X6000 is a great example of how Intel Xeon processors and Intel Omni-path architecture can combine to build industry leading solutions with innovative fabric features that optimize performance, resiliency, and traffic movement,” said Hugo Saleh, Director of Marketing for Intel Scalable Datacenter Solutions.

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FusionServer X6000 is a high density server that accommodates four half-width or two full-width nodes in a 2U chassis, which means customers can fit up to 80 nodes in a rack. Each chassis offers enough space to house 24 NVMe SSDs, helping achieve a single-node throughput of 4.8 million IOPS.

Huawei’s liquid cooling setup uses warm water to extract the heat out of both the CPUs and memory. The total amount of RAM in the sever is defined by the choice of nodes.

The Register notes that this is a hardware refresh, rather than a brand new server: in 2013 Huawei already launched Tecal X6000 High-Density Server in the same form-factor. The older model is no longer a viable option for high density data environments since it relies on older CPUs, slower storage and outdated DDR3 memory.

“With outstanding R&D capabilities and comprehensive product portfolios in the IT domain, Huawei joins hands with industry partners to build joint innovation centers around the globe. We are dedicated to providing our customers IT infrastructures with leading technologies, as well as innovative HPC cloud, HPC, and Big Data solutions to help customers achieve business success,” said William Dong, vice president of Data Center Solution Sales at Huawei Enterprise BG.