This episode will stream live at 10am ET.

The rapid evolution of technologies like AI and high-performance computing is driving unprecedented demand for data center resources. This surge is intensifying power density requirements and reshaping the data center landscape. Join this episode to discover how data centers can adapt their infrastructure to support these powerful GPUs and what role innovative solutions such as liquid cooling and air-assisted liquid cooling will play in the future. This discussion will demonstrate how data center operators, chip manufacturers, and end-users can work together to meet the ever-increasing demands of AI and HPC workloads through an in-depth exploration of cooling and advanced chipsets.

• Discover how to ensure data centers are optimized for next-gen GPUs while considering environmental impact
• Examine how flexible cooling technologies can be designed to meet the increased density requirements and rising temperatures of next-generation technologies
• Explore the benefits and challenges of a modular approach to liquid cooling and air-assisted liquid cooling