Synopsys has announced a complete UCIe IP solution operating at up to 40 Gbps.
Designed to address the increased compute performance requirements of AI data centers, Synopsys said it delivers maximum bandwidth for die-to-die connectivity in high-performance AI data center chips.
The solution is an industry first and includes a controller, PHY, and verification IP, in addition to a complete protocol stack that supports multiple protocols, including AXI, CHI C2C, CXS, PCIe, CXL, and streaming, to allow a die-to-die connection between fabrics.
The offering also enables fast connectivity between heterogeneous and homogeneous dies and, according to Synopsys, supports 25 percent more bandwidth compared to the UCIe specification, providing 12.9Tbps/mm of data to travel between heterogeneous and homogeneous dies without impacting energy efficiency and silicon footprint.
This allows the new solution, referred to by Synopsys as the ‘40G UCIe,’ to meet the needs of demanding applications, such as high-performance server chips, SoCs, and custom high-bandwidth memory stacks, while still enabling the use of low-cost substrate packaging for high-performance multi-die packages.
Other features include a single reference clock that simplifies the clocking architecture and optimizes power; embedded monitors to ensure reliability at the die, die-to-die, and multi-die package levels; and pre-verified design reference flow that includes all the required design collateral.
“Launching the industry’s first complete 40G UCIe IP solution underscores Synopsys’ continued investment in advancing semiconductor innovation,” said Michael Posner, vice president of IP product management at Synopsys. “Our active contribution to the UCIe consortium has enabled us to deliver a robust UCIe solution that helps our customers successfully develop and optimize their multi-die designs for high-performance AI computing systems.”
Synopsys said the 40G UCIe IP solution is built on “current, mature architecture” and has achieved interoperability and “silicon successes” across “multiple advanced foundries and processes.” It will be available in late 2024 for those as yet unconfirmed foundries and processes.
