Liquid cooling company JetCool has raised $17 million in a Series A funding round.
Investment in the startup was led by Bosch Ventures, the corporate venture capital arm of the Bosch Group, and includes participation from In-Q-Tel, Raptor Group, and Schooner Capital. Bosch Ventures Investment Partner Adam Jackson will join JetCool’s board of directors.
The company develops direct-to-chip cooling solutions, but claims that its microconvective cooling technology makes its cold plates more efficient at heat transfer. Instead of passing fluid over a surface, its cooling jets route fluid directly at the surface.
This, it says, allows it to support chip TDPs of more than 1,000 watts. Its first generation liquid-assisted air cooling system supports racks up to 50kW.
"In the rapidly evolving tech landscape, with advanced AI platforms and complex chip designs, there's an urgent need to address increasing heat, power, and water consumption in data centers," said Bernie Malouin, JetCool CEO.
"With support from Bosch Ventures, IQT, and our current investors, JetCool is poised to meet this demand and revolutionize the cooling industry."
In May, Dell Technologies unveiled PowerEdge servers with JetCool's SmartPlate System. The next month, JetCool partnered with DuPont to create a sales channel to target semiconductor companies in Taiwan and Singapore.
